Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface

Olbrechts, Benoit;Lejeune, Benoit;Bertholet, Y.;Pardoen, Thomas;Raskin, Jean-Pierre
(2006) Electrochemical Society. Transactions — Vol. 3, n° 6, p. 279-289 (2006)

Files

No attached file found for this publication.

Details

Authors
Affiliations

Citations

  • APA
  • Chicago
  • FWB

Olbrechts, B., Lejeune, B., Bertholet, Y., Pardoen, T., & Raskin, J.-P. (2006). Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface. Electrochemical Society. Transactions, 3(6), 279-289. https://doi.org/10.1149/1.2357078 (Original work published 2006)