Fully coupled semi-analytical model for an electromagnetic-mechanical-thermal problem of a ring expansion test
(2018) 8th International Conference on High Speed Forming — Location: Columbus, USA (13.May.2018)
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- Authors
Sapanathan, Thaneshan 
- Abstract
- A fully coupled semi-analytical model is proposed for a ring expansion test. In this model, we consider the electromagnetic, mechanical and thermal effects. During the development, an ideal case of electromagnetic ring expansion test is modelled using both semi-analytical and finite element methods. The analytical model also includes the changes in electrical resistance, mutual inductance and self-inductance as a function of radius during the ring expansion. The development procedure is divided into four separate calculation parts. Each individual part is validated before making the independent validation of the semi-analytical method to obtain a model with high accuracy and a robust calculation speed. The final prediction using this model closely resemble with the coupled finite element predictions, and it can be further extended to exploit for an inverse identification problem.
- Affiliations
Citations
Yang, K., Sapanathan, T., Raoelison, R. N., Buiron, N., & Rachik, M. (2018). Fully coupled semi-analytical model for an electromagnetic-mechanical-thermal problem of a ring expansion test. 8th International Conference on High Speed Forming, Columbus, USA. https://hdl.handle.net/2078.5/61652