Modeling and Characterization of TSV-Induced Noise Coupling

Rack, Martin;Rack, Martin;Van der Plas, Geert;Raskin, Jean-Pierre;Beyne, Eric
(2017) Noise Coupling in System-on-Chip — ISBN: [9781498796774], p. 195-232, published

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Abstract
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
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Rack, M., Rack, M., Van der Plas, G., Raskin, J.-P., & Beyne, E. (2017). Modeling and Characterization of TSV-Induced Noise Coupling. In Thomas Noulis (ed.), Noise Coupling in System-on-Chip (p. p. 195-232). CRC Press, Taylor & Francis Group. https://hdl.handle.net/2078.5/173793