Direct wafer bonding issues : surface activation, high and low temperature annealing and insertion of a ductile layer for absorbing constraints

Olbrechts, Benoit;Bertholet, Y.;Pardoen, Thomas;Raskin, Jean-Pierre
(2004) Workshop on Wafer Bonding for MEMS Technologies — Location: Halle, Germany (11.October.2004)

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Olbrechts, B., Bertholet, Y., Pardoen, T., & Raskin, J.-P. (2004). Direct wafer bonding issues : surface activation, high and low temperature annealing and insertion of a ductile layer for absorbing constraints. Proceedings of the Workshop on Wafer Bonding for MEMS Technologies, p. 25-26. https://hdl.handle.net/2078.5/230608